Summary
Overview
Work History
Education
Skills
Languages
Certification
Timeline
Interests
Affiliations
Social Activities
Hobbies
Driving License
References
CustomerServiceRepresentative
Alper Ogan

Alper Ogan

Lead Hardware Engineer
Bursa

Summary

Hardware Design Engineer with almost 10 years of experience in digital hardware development, embedded systems, and mass-production-oriented designs across automotive, rail systems, robotics, wearables, and public transportation. Skilled in high-speed interfaces (PCIe, DDR, USB, Ethernet), wireless communication (Wi-Fi, Bluetooth, LTE/5G, V2X), and EMC-compliant hardware. Experienced in STM, NXP i.MX, TI, ADI, Qualcomm, Xilinx, Nordic nRF, and board-level bring-up. Proven track record in team leadership, project management, and prototype-to-production lifecycle with strong focus on reliability, scalability, and innovation.

Overview

10
10
years of professional experience
4
4
Certificates

Work History

Lead Hardware Engineer

Daiichi Electronics Inc.
10.2023 - 10.2025
  • Automotive IVI, Cluster, DCU, HPC hardware development
  • Hierarchical schematic design
  • Hardware design with Cyber Security and Functional Safety goals (ASIL-A, ASIL-B)
  • Automotive standard-compliant designs (ISO-26262, etc.)
  • Platform hardware development based on NXP (i.MX RT1171, i.MX8QP), Renesas (R-Car E3), Infineon (Traveo T2G), Qualcomm (SA6155, SA7155, SA8155, SA7255, SA8255), and Mediatek (MT2712, MT2715) SoCs
  • Design of Wi-Fi 5/6/6e and Bluetooth 5.0+ solutions with Qualcomm, Mediatek, Nordic, etc.
  • Amplifier and AM/FM/DAB integration
  • LVDS, GMSL2/3, FPD-Link II/III/IV, MIPI DSI/CSI (D-PHY, C-PHY), eDP/DP
  • Memory and storage: LPDDR4x, LPDDR5, UFS 2.1/3.1, eMMC 5.1
  • PCIe, USB 2.0 FS/HS, USB 3.0/3.1 SS, I2C, I2S, PCM, SPI, SDIO
  • SerDes camera integration with FPD-Link (III-IV) and GMSL (2-3)
  • CSI-2 based hardware design with camera sensors (OV77xx, OV23xx, On Semi MT9V034, etc.)
  • Preparation of pre-EMC and EMC certification tests according to OEM requirements
  • RFS, RFI, RFQ process management
  • Hardware project planning
  • Project quoting and pricing for high-volume production

Senior Hardware Design Engineer

Hibot Corp.
06.2023 - 09.2023
  • Robotic hardware development
  • Development of BLDC motor drivers (Outrunner type) used in various robotic systems
  • Design of robotic communication boards (RS232, RS485, Ethernet, etc.)
  • Development of MCU-based robotic control boards
  • Design of power boards for different unit types (linear and switch-mode supplies)

Senior Hardware Design Engineer & Team Leader

Soar Robotics Inc.
06.2020 - 06.2023
  • Development and deployment of 5G software and base stations for aviation and autonomous automobile networks, operating in licensed cellular frequencies
  • Enabling scalable autonomous flights for urban and industrial applications with seamless connectivity and cloud intelligence
  • Hardware integration with Simcom, Quectel, and Huawei C-V2X modules
  • System-on-Module (SOM), Computer-on-Module, and carrier board hardware designs
  • Hardware design with Xilinx Kintex-7 and ARM Cortex-A7/A35/A53/A72 architectures
  • GPU-accelerated high-performance industrial hardware designs compliant with CE, EMC, AEC-Q200, and other standards
  • Linux distributions and RTOS bring-up for custom high-frequency hardware platforms
  • RF hardware designs covering 70 MHz–6.5 GHz SDR applications
  • High-frequency digital hardware designs: DDR3/DDR4, eMMC 5.0, PCIe, M.2
  • Hardware design for IoT modules using Wi-Fi 6 (802.11 a/g/n/ac/ax), V2X, V2I, V2G, BLE 5.1, LTE/5G with Qualcomm solutions
  • Power sequencing, device tree, and BSP development for hardware bring-up
  • Management of prototype production and mass production with budgets exceeding $1M, collaborating with companies in the USA, Asia, and Europe
  • Turnkey management of mass production and organizational leadership for hardware development teams
  • Camera hardware design (e.g., AR0234, OV5640) with NXP i.MX8MM for Suzuki Inc.

Embedded Systems & Product Development Engineer

Walkovr Inc.
05.2018 - 05.2020
  • Design and production of wearable technology devices
  • Motion tracking, virtual environment integration, and development of required hardware and software
  • Modbus (RS485) protocol frame creation and debugging
  • Bluetooth 2.0 and BLE 4.1 hardware design and communication frame integration
  • EMC/ESD-compliant PCB designs
  • Real-time sensor integration, high-accuracy sensor fusion, and filter implementations (Kalman, complementary, etc.)
  • Mass production process management and tracking (order creation, production monitoring, etc.)
  • Wireless hardware and software development with Wi-Fi 802.11 b/g/n
  • PCB and software development using Nordic nRF52 and STM32 ARM Cortex-M0 to M4 chipsets
  • C# SDK development for Unity and MATLAB integration
  • Full-body motion tracking for VR locomotion using quaternions and Kalman-based filters
  • Hardware design for 2.4 GHz band front-end amplifiers and chipsets
  • End-to-end mass production management: PCB manufacturing, assembly, multi-ARM firmware flashing, chipset integration (IP/MAC), testing, boxing, and shipping
  • Development of test systems and mass-manufacturing equipment

Embedded Systems Engineer

Kodeco Design and Engineering Inc.
09.2017 - 04.2018
  • Chassis electrical distribution design and analysis for solar-powered ultra-light electric vehicles
  • Component selection, prototyping, and product design for mass production
  • CAN-Bus-based hardware and embedded software development for HMI, infotainment, displays, and sensors
  • STM32-based electronic board and embedded software design compliant with TS EN 50130-4

Software Developer

Kentkart Ege Electronics Inc.
12.2016 - 09.2017
  • Public transportation payment systems – application layer software development on Embedded Linux (NXP i.MX8) for TVM and AVM devices
  • HAL software development for coin modules and system integration
  • Embedded Linux application development for ticketing and payment systems
  • Integration of hardware modules and peripherals into public transportation devices

Product Development Engineer

Safkar Air Conditioning Systems Inc.
04.2016 - 11.2016
  • Rail systems and military vehicle HVAC system design and development (projects with Hyundai Eurotem, Durmazlar, TEMSA, ISUZU, BMC, etc.)
  • Electrical diagram design for 12V, 24V, 380V, and 750V bus and rail systems
  • Prototyping, routine and type testing, and product development for HVAC applications
  • Upgrade and renewal projects for connection and cooling systems in rail transportation

Education

Bachelor of Engineering - Electrical & Electronics Engineering

Ege University
Izmir, Turkey
01.2016

Bachelor of Engineering - Electrical And Electronics Engineering

Hochschule RheinMain
Frankfurt, Germany
01.2015

High School Diploma -

Suleyman Demirel High School
Aydin, Turkey
06.2010

Skills

Digital High-Speed hardware design

Languages

Turkish - Excellent
English - Good
German - Basic

Certification

2015-05 Bachelor's Thesis First Prize

Timeline

Lead Hardware Engineer

Daiichi Electronics Inc.
10.2023 - 10.2025

Senior Hardware Design Engineer

Hibot Corp.
06.2023 - 09.2023

Senior Hardware Design Engineer & Team Leader

Soar Robotics Inc.
06.2020 - 06.2023

Embedded Systems & Product Development Engineer

Walkovr Inc.
05.2018 - 05.2020

Embedded Systems Engineer

Kodeco Design and Engineering Inc.
09.2017 - 04.2018

Software Developer

Kentkart Ege Electronics Inc.
12.2016 - 09.2017

Product Development Engineer

Safkar Air Conditioning Systems Inc.
04.2016 - 11.2016

Bachelor of Engineering - Electrical & Electronics Engineering

Ege University

Bachelor of Engineering - Electrical And Electronics Engineering

Hochschule RheinMain

High School Diploma -

Suleyman Demirel High School

Interests

Photography, Motor Sports, Musical Instruments, Camping, Gym, Powerlifting

Affiliations

  • Ege IEEE RAS Founder and Manager
  • Ege EBILTET(Science-Technology) Society Manager
  • International IEEE Membership

Social Activities

  • Ege IEEE RAS Founder and Manager
  • Ege EBILTET(Science-Technology) Society Manager
  • International IEEE Membership

Hobbies

  • Photography
  • Motor Sports
  • Musical Instruments
  • Camping
  • Gym, Powerlifting

Driving License

  • B
  • A2

References

  • Prof. Dr. Musa Alcı – Head of Electrical and Electronics Engineering Department, Ege University
    Phone: +90 532 250 40 99
  • Harun Özel – Embedded Software Development Team Leader, Daiichi
    Phone: +90 541 432 74 88
  • Onuralp Şahin – Hardware Team Colleague, Daiichi
    Phone: +90 531 594 19 50
Alper OganLead Hardware Engineer